dc.contributor.author | Aida Fakhrul, Lamakasauk | |
dc.contributor.author | Nurul Shakina, Surani | |
dc.contributor.author | Mohd Arif Anuar, Mohd Salleh | |
dc.contributor.author | Nik Noriman, Zulkepli, Dr. | |
dc.contributor.author | Mohd Mustafa Al-Bakri, Abdullah | |
dc.contributor.author | Rosniza, Hamzah | |
dc.contributor.author | Mohamad, Abu Bakar | |
dc.date.accessioned | 2013-06-11T09:17:04Z | |
dc.date.available | 2013-06-11T09:17:04Z | |
dc.date.issued | 2012-07-17 | |
dc.identifier.uri | http://dspace.unimap.edu.my/123456789/25704 | |
dc.description | This team has won gold medal at National Research and Innovation Competition (NRIC) 2012, 17th - 19th July 2012 was held at Dewan Utama Pelajar, located at USM Main Campus, Penang, Malaysia. | en_US |
dc.description.abstract | Underfill is a material used to provide a stronger mechanical connection, provide heat bridge and to ensure the soldier joint are not stressed out due to differential heating on the chip and the rest of system. | en_US |
dc.publisher | Universiti Sains Malaysia | en_US |
dc.relation.ispartofseries | National Research and Innovation Competition (NRIC) 2012 | en_US |
dc.subject | Underfill material | en_US |
dc.subject | Polymer hybrid | en_US |
dc.subject | Epoxy polymer | en_US |
dc.subject | Underfill material in electronic packaging | en_US |
dc.subject | UniMAP -- Research and development | en_US |
dc.subject | UniMAP -- Competition | en_US |
dc.subject | National Research and Innovation Competition 2012 | en_US |
dc.subject | NRIC 2012 | en_US |
dc.title | Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application | en_US |
dc.contributor.url | arifanuar@unimap.edu.my | en_US |