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dc.contributor.authorWan Mohd Arif, Wan Ibrahim
dc.contributor.authorYeoh, Cheow Keat, Dr.
dc.contributor.authorTeh, Pei Leng, Dr.
dc.contributor.authorNoorina Hidayu, Jamil
dc.date.accessioned2014-03-17T02:58:53Z
dc.date.available2014-03-17T02:58:53Z
dc.date.issued2013
dc.identifier.citationAdvanced Materials Research, vol. 795, 2013, pages 591-596en_US
dc.identifier.isbn978-303785811-0
dc.identifier.issn1022-6680
dc.identifier.urihttp://www.scientific.net/AMR.795.591
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/32783
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractThis project is focused to study on the cooling performance of liquid cooling system under different process parameter. In this research, a liquid cooling system with copper block that simulates CPU, was setup to identify cooling performance of distilled water and vegetable oil at different mass flow rates (distilled water: 8.00g/s, 10.60g/s & 13.24g/s; vegetable oil: 1.22g/s, 1.30g/s & 1.38g/s) and input power (29.12W & 47.66W). The cooling performance of each fluid was characterized by the properties of: heat transfer coefficient, thermal resistance and also, the maximum CPU temperature (T4 at 66min) for the experiments. Experimental data shows that cooling performance was improved at higher mass flow rate and both distilled water and vegetable oil is a good coolant material.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publicationsen_US
dc.subjectHeat fluxen_US
dc.subjectHeat transfer coefficienten_US
dc.subjectInput poweren_US
dc.subjectMass flow rateen_US
dc.subjectThermal resistanceen_US
dc.titleEffect of process parameters on the cooling performance of liquid cooling system for electronic applicationen_US
dc.typeArticleen_US
dc.contributor.urlwanarif@unimap.edu.myen_US
dc.contributor.urlckyeoh@unimap.edu.myen_US
dc.contributor.urlplteh@unimap.edu.myen_US
dc.contributor.urlnoorinahidayu@unimap.edu.myen_US


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