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dc.contributor.authorAzmi, Kamardin
dc.contributor.authorMohd Nazree, Derman, Dr.
dc.contributor.authorMohd Mustafa Al-Bakri, Abdullah
dc.date.accessioned2014-03-18T03:23:44Z
dc.date.available2014-03-18T03:23:44Z
dc.date.issued2013
dc.identifier.citationAdvanced Materials Research, vol. 795, 2013, pages 237-240en_US
dc.identifier.isbn978-303785811-0
dc.identifier.issn1022-6680
dc.identifier.urihttp://www.scientific.net/AMR.795.237
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/32812
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractThe demand for advanced thermal management materials such as silicon carbide reinforced copper matrix (Cu-SiCp) composites is increasing due to their high thermal conductivity and low CTE properties. However, the weak bonding between the copper matrix and the SiCp reinforcement degrades the thermophysical properties of the composites. In order to improve the bonding between the two constituents, the SiCp were copper coated (Cu-Coated) via electroless coating process. Based on the experimental results, the CTE values of the Cu-Coated Cu-SiCp composites were found significantly lower than those of the non-Coated Cu-SiCp composites. The CTEs of the Cu-Coated Cu-SiCp composites were in agreement with Kernel's model which accounts for both the shear and isostatic stresses developed in the component phasesen_US
dc.language.isoenen_US
dc.publisherTrans Tech Publicationsen_US
dc.subjectCopper matrix compositesen_US
dc.subjectElectroless copperen_US
dc.subjectPackaging materialsen_US
dc.subjectPorosityen_US
dc.subjectSilicon carbide particlesen_US
dc.subjectThermal expansionen_US
dc.titleThe thermal expansion behaviors of Cu-SiCp compositesen_US
dc.typeArticleen_US
dc.contributor.urlazmikamardin@unimap.edu.myen_US
dc.contributor.urlnazree@unimap.edu.myen_US
dc.contributor.urlmustafa_albakri@unimap.edu.myen_US


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