Browsing Ruslizam Daud, Assoc Prof. Ir. Dr. by Author "azmn@ukm.my"

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    • Dicing die attach film for 3D stacked die QFN packages 

      Shahrum, Abdullah; S., Mohd Yusof; Ibrahim, Ahmad; Azman, Jalar; Ruslizam, Daud, Dr. (IEEE Conference Publications, 2012)
      The application of die attach film (DAF) in semiconductor packaging is become wider especially in three dimensional (3D) QFN stacked die package. As wafer getting thinner until beyond 100 μm, challenges in die attach process ...