LED heat dissipation study using different Cu slug size

Abstract

High power light emitting diodes (LEDs) have significant contribution in illumination industry due exceptional advantages in terms of low power consumption, superior reliability, prolonged life time and high efficiency. Rapid growth of the LEDs industry has generated a fresh set of thermal challenges which requires immediate attention. This paper presents a simulation work on a single chip high power LED package. This work focuses on the evaluation of the junction temperature and LED chip stress with varied copper rectangular heat slug size under natural convection condition at ambient temperature of 25°C. Ansys version 11 was used for the simulation. The single chip was powered with input power of 0.1 W and 1W respectively. Results exhibited that the heat slug size has significant effect on the junction temperature of the LED.