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dc.contributor.authorChan, Ming Yeng
dc.contributor.authorSalmah, Husseinsyah, Prof. Madya Ir. Dr.
dc.contributor.authorSam, Sung Ting, Dr.
dc.date.accessioned2014-06-19T08:58:08Z
dc.date.available2014-06-19T08:58:08Z
dc.date.issued2013
dc.identifier.citationAdvanced Materials Research, vol. 747, 2013, pages 649-652en_US
dc.identifier.isbn978-303785771-7
dc.identifier.issn1022-6680
dc.identifier.urihttp://www.scientific.net/AMR.747.649
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/35718
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractRecently, there has been renews interest in chitosan as materials in producing of biocomposite films. The chitosan (CS)/corn cob (CC) biocomposite films were prepared by solvent casting method. The effect of CC content on tensile properties of CS/CC biocomposite films was studied. The tensile strength and elongation at break of CS/CC biocomposite films decreased as increasing of CC content. However, the increasing of CC content was increased the tensile modulus of CS/CC biocomposite films. Scanning electron microscopy (SEM) was indicated that the deceasing of tensile properties was due to the poor interfacial adhesion between CC filler and CS matrix.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publicationsen_US
dc.subjectBiocompositeen_US
dc.subjectChitosanen_US
dc.subjectCorn coben_US
dc.subjectFilmsen_US
dc.titleCorn cob filled chitosan biocomposite filmsen_US
dc.typeArticleen_US
dc.contributor.urlchanmingyeng@hotmail.myen_US
dc.contributor.urlirsalmah@unimap.edu.myen_US
dc.contributor.urlstsam@unimap.edu.myen_US


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