Fairul Afzal Ahmad Fuad

 

This page provides access to research works by Fairul Afzal Ahmad Fuad, currently a Lecturer of School Of Computer and Communication Engineering, Universiti Malaysia Perlis.

Recent Submissions

  • Bump height at low temperature analysis 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Steven, Taniselass (Trans Tech Publications (TTP), 2013)
    The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold ...

  • Shear speed analysis on Sn-3.9Ag-0.6Cu Solder 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Ong, Tee Say; Vairavan, Rajendaran (Trans Tech Publications (TTP), 2013)
    Ball Grid Array (BGA) is a type of semiconductor interconnection used in Integrated Circuit (IC) which is being scaled down to micro and nano size. The reliability of BGA in IC becomes a concern as the size of IC reduces. ...

  • 5mm × 5mm sized slug on high power LED stress and junction temperature analysis 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Vairavan, Rajendaran; Nazuhusna, Khalid (Trans Tech Publications (TTP), 2013)
    Conventional incandescent lamps are being replaced by high power light emitting diode as a lighting source due to it ascendancy in terms of physical size, performance, output and lifetime. Nevertheless, the reliability and ...

  • Aluminium surface grain size analysis on RIE treatment 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Palianysamy, Moganraj; Aaron, Koay Terr Yeow (Trans Tech Publications (TTP), 2013)
    Reactive Ion Etch (RIE) has been an important process in the world of microelectronic fabrication. Focus of this preliminary study is on how RIE affects the grain size of aluminum film which is fabricated on substrates. ...

  • Relationship between controllable process parameters on bump height in ENIG 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Fairul Afzal, Ahmad Fuad; Ehkan, Phaklen, Dr.; Muhamad Hafiz,  Ab Aziz (Trans Tech Publications, 2013)
    This paper reports the factors that affect the bump height in electroless nickel immersion gold (ENIG) and their interrelation between each other. Bump height is a critical issue that needs to be investigated because a ...

  • Energy efficient segmentation-link strategies for transparent IP over WDM core networks 

    Mohd Nazri, Mohd Warip; Ivan, Andonovic; Ivan Glesk; Phaklen, Ehkan, Dr.; Fairul Afzal, Ahmad Fuad; Mohamed Elshaikh Elobaid, Said Ahmed (Engineering and Technology Publishing, 2014-01)
    Recent developments in Optical IP networks have heightened the need for reduction on power consumption via so called green photonics and concepts known as green networking. Adhering to these principles we proposed a novel ...