Browsing Vithyacharan Retnasamy by Author "kbyap@uniten.edu.my"

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Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

Yap, Boon Kar, Dr.; Noor Azrina, Talik; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan (Emerald Group Publishing Limited, 2013)

Purpose - The increased use recently of area-array technology in electronic packaging has similarly increased the importance of predicting the thermal distribution of area-array solder interconnection. As the interconnection ...
Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

Yap, Boon Kar, Dr.; Noor Azrina, Talik; Zaliman, Sauli, Dr.; Foong, Chee Seng; Tan, Chou Yong, Dr.; Retnasamy, Vithyacharan (Emerald Group Publishing Limited, 2013)

Purpose - This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue, formed during the die attachment ...