Browsing by Subject "Quad Flat Package"
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Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP
(Universiti Malaysia PerlisSchool of Materials Engineering, 2008-05)In integrated circuit (IC) Packaging, there are several processes involved. The main processes for leaded package are wafer mount, wafer saw, die attach, wire bonding, molding, plating, singulation, trim and form. Molding ...