dc.contributor.author | Mohd Arif Anuar, Mohd Salleh | |
dc.contributor.author | Noraniza, Saud | |
dc.contributor.author | Najib Saedi, Ibrahim | |
dc.date.accessioned | 2014-05-29T08:19:50Z | |
dc.date.available | 2014-05-29T08:19:50Z | |
dc.date.issued | 2013 | |
dc.identifier.citation | Advanced Materials Research, vol.795, 2013, pages 522-525 | en_US |
dc.identifier.issn | 1662-8985 | |
dc.identifier.uri | http://www.scientific.net/AMR.795.522 | |
dc.identifier.uri | http://dspace.unimap.edu.my:80/dspace/handle/123456789/34873 | |
dc.description | Link to publisher's homepage at http://www.scientific.net/ | en_US |
dc.description.abstract | Nowadays, excessive growth intermetallic formation becomes the major issue in electronic packaging industry. The investigation on the effect of aging temperature to the intermetallic compound (IMCs) growth formation for Sn-0.7Cu/1.0-Si3N4 was studied. Isothermal aging process was carried out for 24 hours, with 5 difference aging temperature from 50°C up to 150°C. It is found that the Cu-Sn IMCs which appear after reflowed process, has grew rapidly when aging temperature was increased up to 125°C and started to reduced after 150°C aging temperature. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Trans Tech Publications | en_US |
dc.subject | Aging | en_US |
dc.subject | Composite | en_US |
dc.subject | Intermetallic | en_US |
dc.title | Effect of aging temperature on the intermetallic compound (IMC) formation of Sn-0.7Cu/Si3N4 composite solder | en_US |
dc.type | Article | en_US |
dc.identifier.url | 10.4028/www.scientific.net/AMR.795.522 | |
dc.contributor.url | arifanuar@unimap.edu.my | en_US |