Effect of the different printing patterns of Graphene Nanoparticles in conductive ink on electrical and mechanical performance
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Date
2021-08Author
Adzni, Md. Saad
Mohd Azli, Salim
Mohammed Hussin A. Al-Mola
Fauzi, Ahmad
Hartini, Saad
Mohd Zaid, Akop
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Show full item recordAbstract
The utilization of graphene in the formation of conductive ink has been positively accepted
by the electronics industry especially with the emerging of printable and flexible
electronics. Because of that, it motivates this study to investigate the electrical, mechanical,
and morphological properties for different patterns of Graphene Nanoparticle (GNP)
conductive ink. The samples were prepared using the screen-printing technique with a low
annealing temperature of 100 ºC for 30 minutes. The investigated parameter for the
electrical property was the sheet resistivity, which showed that the zigzag pattern
recorded the highest value of 1.077 kΩ/sq at the 3 mm of ink thickness. For the mechanical
properties, the highest of hardness for 2 mm thickness was the curve pattern and for 3 mm
was the square pattern, with the values of 3.849 GPa and 4.913 GPa. Both maximum values
showed a direct correlation with the behavior of the elastic modulus of the ink. The
maximum values of elastic modulus were recorded at the same ink pattern and thickness.
For the morphological analysis, the surface roughness and qualitative analysis using SEM
images were performed. The surface roughness showed that the increase of GNP in the
composition increased the surface roughness because it decreased the homogeneity of the
mixture. The recorded SEM images of the ink layer microstructure surface showed a direct
correlation with the obtained sheet resistivity data. The samples that produced high sheet
resistivity showed the presence of bumps, creases, and defects on the ink layer surface.
Based on the obtained data, the correlation between electrical, mechanical, and
morphological properties can be established for the GNP conductive ink with various
patterns and thicknesses.