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dc.contributor.authorMamun, Ibne Reaz
dc.contributor.authorLee, W. F.
dc.contributor.authorHamid, N. H.
dc.contributor.authorLo, H. H.
dc.contributor.authorAli Yeon, Mohd Shakaff, Prof. Dr.
dc.date.accessioned2010-08-26T07:47:16Z
dc.date.available2010-08-26T07:47:16Z
dc.date.issued2009
dc.identifier.citationJournal of Applied Sciences, vol. 9(14), 2009, pages 2613-2618en_US
dc.identifier.issn1812-5654
dc.identifier.urihttp://www.scialert.net/pdfs/jas/2009/2613-2618.pdf
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/9170
dc.descriptionLink to publisher's homepage at www.ansinet.com/en_US
dc.description.abstractThis study describes an efficient design methodology from an industrial perspective on utilizing Register Transfer Level (RTL) coding style, full scan chain implementation and Automatic Test Pattern Generation (ATPG) to achieve a high percentage of testability in the final Integrated Circuit (IC). The design methodology involves using an ASIC design flow with scan insertion and scan stitching performed after synthesis with scan flops set as don’t_use during synthesis process. Based on this method of ASIC design flow with the RTL coding style and guideline, an in-house 64 bit processor core that executes 3 instructions per cycle, is implemented with 0.35 micron process technology with a single scan chain of 4600 flip-flops, achieving an ATPG pattern for stuck-at at 100% test coverage and 99.81% fault coverage. Thus, creating high testability coverage with the ATPG pattern can be achieved by having a fully synchronous design using the proposed RTL coding style and full scan chain implementation. This study also describes the work around methods used when dealing with cost reduction involving reduction of test pin on the IC chip package.en_US
dc.language.isoenen_US
dc.publisherAsian Network for Scientific Informationen_US
dc.subjectAutomatic test pattern generationen_US
dc.subjectDesign for testen_US
dc.subjectDFT design methodologyen_US
dc.subjectGuidelineen_US
dc.subjectIC chip packagingen_US
dc.subjectIntegrated circuiten_US
dc.subjectScan chainen_US
dc.subjectSharing pin for testingen_US
dc.subjectVLSIen_US
dc.titleHigh degree of testability using full scan chain and ATPG-An industrial perspectiveen_US
dc.typeArticleen_US


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