Statistics
Total Visits
| Views | |
|---|---|
| Technical barriers and development of Cu wirebonding in nanoelectronics device packaging | 123 |
Total Visits Per Month
| October 2024 | November 2024 | December 2024 | January 2025 | February 2025 | March 2025 | April 2025 | |
|---|---|---|---|---|---|---|---|
| Technical barriers and development of Cu wirebonding in nanoelectronics device packaging | 2 | 2 | 6 | 6 | 2 | 3 | 0 |
File Visits
| Views | |
|---|---|
| 173025.pdf | 46 |
Top country views
| Views | |
|---|---|
| United States | 55 |
| Sweden | 13 |
| China | 8 |
| Ireland | 8 |
| Finland | 6 |
| Germany | 5 |
| Togo | 4 |
| Australia | 3 |
| Malaysia | 3 |
| Vietnam | 3 |
Top cities views
| Views | |
|---|---|
| San Mateo | 12 |
| Boardman | 8 |
| Dublin | 8 |
| Ashburn | 3 |
| Des Moines | 3 |
| Hanoi | 3 |
| Melbourne | 3 |
| Andover | 2 |
| Balashikha | 2 |
| Kuala Lumpur | 2 |