Statistics
Total Visits
| Views | |
|---|---|
| Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder | 267 |
Total Visits Per Month
| March 2025 | April 2025 | May 2025 | June 2025 | July 2025 | August 2025 | September 2025 | |
|---|---|---|---|---|---|---|---|
| Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder | 10 | 8 | 9 | 15 | 3 | 11 | 4 |
File Visits
| Views | |
|---|---|
| Intermetallic Compound Formation on Solder Alloy.pdf | 61 |
Top country views
| Views | |
|---|---|
| United States | 135 |
| China | 24 |
| Brazil | 12 |
| Germany | 11 |
| Ireland | 10 |
| Russia | 9 |
| Finland | 8 |
| Sweden | 7 |
| Senegal | 6 |
| Togo | 6 |
Top cities views
| Views | |
|---|---|
| Ashburn | 47 |
| San Mateo | 24 |
| Seattle | 11 |
| Dublin | 10 |
| Hangzhou | 6 |
| Boardman | 5 |
| Hanoi | 3 |
| Andover | 2 |
| Chengdu | 2 |
| Des Moines | 2 |