Browsing Ghulam Abdul Quadir, Prof. Dr. by Issue Date
Now showing items 1-20 of 45
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Analysis of microchannel heat exchangers using FEM
(Emerald Group Publishing, 2000)A finite element method is applied to evaluate the performance of microchannel heat exchangers that are used in electronic packaging. The present approach is validated against the CFD data available in the literature. A ... -
Performance of wire-on-tube heat exchangers used in immersion cooling for electronic packages
(IEEE Conference Publications, 2000)In this investigation, closed loop immersion cooling of an electronic package with external condenser-a wire-on-tube heat exchanger being attached to its enclosure-is analysed. The dielectric vapour leaving the enclosure ... -
Plant based energy potential and biomass utilization in Malaysia
(Regional Energy Resources Information Center (RERIC), 2000-12)The paper assesses the energy productivity of the major plantation crops in Malaysia as well as the status of bioenergy utilization in the country. Of the crops studied and under present local cultivation practices, oil ... -
Finite element modelling of solidification phenomena
(Springer India, 2001)The process of solidification process is complex in nature and the simulation of such process is required in industry before it is actually undertaken. Finite element method is used to simulate the heat transfer process ... -
Numerical and experimental heat transfer studies on totally enclosed fan ventilated machines
(Taylor and Francis Group, LLC, 2002)Accurate prediction of temperature distribution in an electrical machine at the design stage is becoming increasingly important. It is essential to know the locations and magnitudes of hot spot temperatures for optimum ... -
Modeling of wire-on-tube heat exchangers using finite element method
(Elsevier Ltd., 2002)Wire-on-tube heat exchangers are analysed under normal operating conditions (free convection) using finite element method. Galerkin's weighted residual method is used to minimise the errors. The effects of ambient temperatures ... -
Optimization of PCB component placement using genetic algorithm
(World Scientific Publishing, 2002)This paper focuses on optimization problems faced in automated assembly of Printed Circuit Board (PCB). In order to optimize the throughput rate of these automated machines, the time taken for the pick and place operation ... -
Experimental investigation of a downdraft biomass gasifier
(Elsevier Ltd., 2002)An experimental investigation of a downdraft biomass gasifier is carried out using furniture wood and wood chips. The effect of equivalence ratio on the gas composition, calorific value and the gas production rate is ... -
Flip chip thermal test vehicle design: Requirements, evaluations, and validations
(ASME, 2003)This paper reviews the design of a flip chip thermal test vehicle. Design requirements for different applications such as thermal characterization, assembly process optimization, and product burn-in simulation are outlined. ... -
Thermal management of multichipmodule (MCM) using genetic algorithms
(IEEE Conference Publications, 2003)The placement of power dissipating chips for a multichip module (MCM) is carried out using genetic algorithms. Since high power is to be dissipated over a small area of a module, the heat must be conducted away efficiently. ... -
Fast transient solutions for heat transfer [FEM]
(IEEE Conference Publications, 2003)The implementation of the finite element method (FEM) in thermal analysis usually produces a formulation in the space/time domain. This kind of space/time domain formulation leads to a set of ordinary differential equations ... -
Steady state finite element analysis of a double stack cold plate with heat losses
(Springer-Verlag, 2003)A generalised formulation of the steady state analysis of a double stack cold plate, with and without heat losses from their top and bottom surfaces using dimensionless parameters, is carried out. Galerkin's weighted ... -
FEM analysis of multifluid heat exchangers
(Emerald Group Publishing Limited, 2004)Heat exchangers are devices for exchanging energy between two or more fluids. They find applications in various industries like power, process, electronics, refining, cryogenics, chemicals, metals and manufacturing sector. ... -
Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization
(Emerald Group Publishing Limited, 2004)This paper presents the thermal analyses carried out to predict the temperature distribution of the silicon chip with non-uniform power dissipation patterns and to determine the optimal locations of power generating sources ... -
Prediction of temperature in silicon chip with non-uniform power: a Lagrangian interpolation approach
(Emerald Group Publishing Limited, 2004)This paper describes a generalized method of predicting the temperature distribution of the silicon chip with non-uniform power dissipation patterns using Lagrangian interpolation function. A simplified heat sink thermal ... -
Flow analysis for flip chip underfilling process using characteristic based split method
(IEEE Conference Publications, 2004)In this paper, an effort has made to analyze and numerically simulate the fluid flow in chip cavity using characteristic based split (CBS) method. Simulation methodology includes a solver for the fluid flow equations coupled ... -
Steady and unsteady thermal analysis of a triple stack cold plate with heat losses
(Emerald Group Publishing Limited, 2005)Purpose - To provide some new and additional data for the design of a triple stack cold plate. Design/methodology/approach - A detailed finite element formulation for the triple stack cold plate with and without heat losses ... -
Thermal analysis of micro-channel heat exchangers with two-phase flow using FEM
(Emerald Group Publishing Limited, 2005)Purpose - To analyze two-phase flow in micro-channel heat exchangers used for high flux micro-electronics cooling and to obtain performance parameters such as thermal resistance, pressure drop, etc. Both uniform and ... -
Application of artificial neural network for fatigue life prediction
(Trans Tech Publications, 2005)An extensively published and correlated solder joint fatigue life prediction methodology is incorporated by which finite element simulation results are translated into estimated cycles to failure. This study discusses the ... -
Optimization of thermal resistance of stacked micro-channel using genetic algorithms
(Emerald Group Publishing Limited, 2005)Purpose - To determine the optimal dimensions for a stacked micro-channel using the genetic algorithms (GAs) under different flow constraints. Design/methodology/approach - GA is used as an optimization tool for optimizing ...