Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir.
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About Associate Professor Dr. Ir. Mohd Arif Anuar Mohd Salleh
Associate Professor Dr. Ir. Mohd Arif Anuar Mohd Salleh is currently a Associate Professor at Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis
He was formerly from School of Mechatronic Engineering
ORCID ID: https://orcid.org/0000-0002-9523-7558
Scopus Author ID: 55543476900
Email: Mohd Arif Anuar Mohd Salleh
Research Interests
Materials
Metallurgical Engineering
Materials Testing
Materials Engineering
Recent Submissions
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The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
(MDPI AG, 2021-02)The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength ... -
Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
(MDPI AG, 2021-02)This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) ... -
Hybrid mold: comparative study of rapid and hard tooling for injection molding application using Metal Epoxy Composite (MEC)
(MDPI AG, 2021-02)The mold-making industry is currently facing several challenges, including new competitors in the market as well as the increasing demand for a low volume of precision moldings. The purpose of this research is to appraise ... -
Microstructure evolution of Ag/TiO₂ thin film
(MDPI AG, 2021-01)Ag/TiO₂ thin films were prepared using the sol-gel spin coating method. The microstructural growth behaviors of the prepared Ag/TiO₂ thin films were elucidated using real-time synchrotron radiation imaging, its structure ... -
Bonding strength characteristics of FA-based geopolymer paste as a repair material when applied on OPC substrate
(MDPI AG, 2020-05)This investigative study aims to study the mechanical and morphological properties of fly ash (FA)-based geopolymer paste as a repair material when applied on ordinary Portland cement (OPC) overlay concrete. The first part ... -
Effect of graphene oxide on microstructure and optical properties of TiO₂ thin film
(IOP Publishing Ltd, 2019-12)GO/TiO₂ thin films have been synthesized from titanium (IV) isopropoxide (TTIP) by a sol-gel method. The films were deposited onto a glass substrate using spin coating deposition technique then were subjected to annealed ... -
A review of geopolymer ceramic as a potential reinforcement material in solder alloys
(IOP Publishing Ltd, 2019-12)Nowadays, lead-free solder has been currently used in electronic packaging technology as part of soldering material. Since SnPb was detected to produce toxicity and might harm the consumers, the usage of Pb solder has been ... -
Microstructural studies of doped PEG Ag/TiO₂ thin film
(IOP Publishing Ltd, 2019-12)Ag/TiO₂ thin film was prepared by the sol-gel method through the hydrolysis of titanium tetraisopropoxide and silver nitrate solution. Various amount of PEG was doped into the solution preparation to study the effect on ... -
Synthesis and charactherization of TiO₂ doped SnO₂ thin film prepared by sol-gel method
(IOP Publishing Ltd, 2019-12)In this work, preparation of titanium dioxide doped with tin oxide, SnO₂/TiO₂ thin films deposited onto silicon wafer via sol-gel method. Different amount of SnO₂ was added (5 ml, 10ml and 15 ml) into parent solution. The ... -
Influence of kaolin geopolymer ceramic additions to the wettability and electrical properties of Sn-3.0Ag-0.5Cu (SAC305) lead free solder
(IOP Publishing Ltd, 2019-12)The effect of kaolin geopolymer ceramic addition to the wettability and electrical resistivity of Sn-3.0Ag-0.5Cu (SAC305) lead free solder was successfully explored. Powder metallurgy with microwave sintering method was ... -
Microstructure and wettability of Graphene Oxide/TiO2 thin film prepared via sol-gel method
(IOP Publishing Ltd, 2019-08)The microstructure of graphene oxide TiO2 (GO/TiO2) films on wettability and morphology properties were studied at different amount of Titanium isopropoxide with fixed amount of GO. GO/TiO2 thin films were prepared by using ... -
Mesoporous structure of doped and undoped PEG on Ag/TiO₂ thin film
(IOP Publishing Ltd, 2019-08)In this reaserch, photocatalyst silver titanium dioxide was doped and modified by Polyethylene Glycol (PEG). The purpose of the present study was to analyse the synthesized Ag/TiO₂ thin film doped and undoped PEG. Ag/TiO₂ ... -
Graphene geopolymer hybrid: a review on mechanical properties and piezoelectric effect
(IOP Publishing Ltd, 2019-08)A review on graphene geopolymers hybrid is presented, focusing on the mechanical properties and piezoelectric effect. The method and way of mixing graphene with geopolymers are discussed, including form of graphene that ... -
Recent graphene oxide/TiO₂ thin film based on self-cleaning application
(IOP Publishing Ltd, 2019-08)Graphene oxide/TiO₂ (GO/TiO₂) thin films works as self-cleaning device have been developed in various method onto selected substrates. It was noticeable that graphene oxide is the best form in the group of graphene family. ... -
Phase study of titanium dioxide nanoparticle prepared via sol-gel process
(IOP Publishing Ltd, 2018-03)In this study, titanium dioxide nanoparticles have been prepared via sol-gel process using titanium tetraisopropoxide as a precursor with hydrochloric acid as a catalyst, and ethanol with deionized water as solvents. The ... -
Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review
(IOP Publishing Ltd, 2017-06)In this digital-age era, solder plays important role in electronic packaging industries. As interconnects material, solder provide an electrical and mechanical support to the electronics devices. Solder usually consist of ... -
An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite
(EDP Sciences, 2016)In this research, varying fraction of titanium oxide (TiO2) reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution ... -
Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
(EDP Sciences, 2016-10)The influence of Activated Carbon (AC) particles on mechanical properties of Sn-Cu-Ni-xAC solder joint was investigated. Five different Activated Carbon (AC) percentage addition (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. ... -
The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering
(Elsevier, 2019-10)This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the microstructure, electrical, wettability and mechanical properties of the Sn-0.7Cu-0.05Ni as a high strength solder. Besides using the ... -
Bonding strength characteristics of FA-based geopolymer paste as a repair material when applied on OPC substrate
(MDPI AG, 2020-05)This investigative study aims to study the mechanical and morphological properties of fly ash (FA)-based geopolymer paste as a repair material when applied on ordinary Portland cement (OPC) overlay concrete. The first ...