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| Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder | 119 |
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| March 2024 | April 2024 | May 2024 | June 2024 | July 2024 | August 2024 | September 2024 | |
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| Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder | 0 | 0 | 2 | 10 | 5 | 9 | 2 |
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| Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder.pdf | 33 |
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