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dc.contributor.authorSayyidah Amnah, Musa
dc.contributor.authorMohd Arif Anuar, Mohd Salleh
dc.contributor.authorNorainiza, Saud
dc.date.accessioned2014-05-29T04:40:50Z
dc.date.available2014-05-29T04:40:50Z
dc.date.issued2013
dc.identifier.citationAdvanced Materials Research, vol.795, 2013, pages 518-521en_US
dc.identifier.isbn978-303785811-0
dc.identifier.issn10226680
dc.identifier.urihttp://www.scientific.net/AMR.795.518
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/34855
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractThe developments of lead-free solders have become a major concern to the researchers in electronic industry to replace the lead-containing materials. The concern is not just for low temperature solders but also for high temperature solders. The lead and lead-based compound are highly toxic which is dangerous to human health and environment. The highly suitable lead- free solder candidates for replacing high Pb high temperature solder are Au-Sn, Al-Zn, Zn-Sn, Sn-Sb, and Bi-Ag solders. However, Zn-Sn based solder has highly recommended as the best candidates in replacing high lead high temperature solder. This paper provides a short review of recent research on Zn-Sn based lead free high temperature solders with different additional alloying elements. The new novel alloy of Zn-Sn based for high temperature solder applications will be proposed in this paper.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publicationsen_US
dc.subjectHigh temperature soldersen_US
dc.subjectLead-free solderen_US
dc.subjectZn-Snen_US
dc.titleZn-Sn based high temperature solder - A short reviewen_US
dc.typeArticleen_US
dc.identifier.url10.4028/www.scientific.net/AMR.795.518
dc.contributor.urlarifanuar@unimap.edu.myen_US
dc.contributor.urlnorainiza@unimap.edu.myen_US


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