dc.contributor.author | Sayyidah Amnah, Musa | |
dc.contributor.author | Mohd Arif Anuar, Mohd Salleh | |
dc.contributor.author | Norainiza, Saud | |
dc.date.accessioned | 2014-05-29T04:40:50Z | |
dc.date.available | 2014-05-29T04:40:50Z | |
dc.date.issued | 2013 | |
dc.identifier.citation | Advanced Materials Research, vol.795, 2013, pages 518-521 | en_US |
dc.identifier.isbn | 978-303785811-0 | |
dc.identifier.issn | 10226680 | |
dc.identifier.uri | http://www.scientific.net/AMR.795.518 | |
dc.identifier.uri | http://dspace.unimap.edu.my:80/dspace/handle/123456789/34855 | |
dc.description | Link to publisher's homepage at http://www.ttp.net/ | en_US |
dc.description.abstract | The developments of lead-free solders have become a major concern to the researchers in electronic industry to replace the lead-containing materials. The concern is not just for low temperature solders but also for high temperature solders. The lead and lead-based compound are highly toxic which is dangerous to human health and environment. The highly suitable lead- free solder candidates for replacing high Pb high temperature solder are Au-Sn, Al-Zn, Zn-Sn, Sn-Sb, and Bi-Ag solders. However, Zn-Sn based solder has highly recommended as the best candidates in replacing high lead high temperature solder. This paper provides a short review of recent research on Zn-Sn based lead free high temperature solders with different additional alloying elements. The new novel alloy of Zn-Sn based for high temperature solder applications will be proposed in this paper. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Trans Tech Publications | en_US |
dc.subject | High temperature solders | en_US |
dc.subject | Lead-free solder | en_US |
dc.subject | Zn-Sn | en_US |
dc.title | Zn-Sn based high temperature solder - A short review | en_US |
dc.type | Article | en_US |
dc.identifier.url | 10.4028/www.scientific.net/AMR.795.518 | |
dc.contributor.url | arifanuar@unimap.edu.my | en_US |
dc.contributor.url | norainiza@unimap.edu.my | en_US |