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dc.contributor.authorZaliman, Sauli, Dr.
dc.contributor.authorRetnasamy, Vithyacharan
dc.contributor.authorFairul Afzal, Ahmad Fuad
dc.contributor.authorEhkan, Phaklen, Dr.
dc.contributor.authorMuhamad Hafiz,  Ab Aziz
dc.date.accessioned2014-06-10T09:08:40Z
dc.date.available2014-06-10T09:08:40Z
dc.date.issued2013
dc.identifier.citationApplied Mechanics and Materials, vol. 404, 2013, pages 62-66en_US
dc.identifier.isbn978-303785845-5
dc.identifier.issn1660-9336
dc.identifier.urihttp://www.scientific.net/AMM.404.62
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/35335
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractThis paper reports the factors that affect the bump height in electroless nickel immersion gold (ENIG) and their interrelation between each other. Bump height is a critical issue that needs to be investigated because a certain quality and requirements of bump height needs to be achieved prior to reflow oven soldering process. A total of four controllable process variables, with 16 sets of experiments were studied using a systematically designed design of experiment (DOE). The result suggests that the electroless nickel bath time has the most significant effect on the formation on bump height and consequently provide larger area for conductivity.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publicationsen_US
dc.subjectBump heighten_US
dc.subjectDOEen_US
dc.subjectENIGen_US
dc.titleRelationship between controllable process parameters on bump height in ENIGen_US
dc.typeArticleen_US
dc.contributor.urlzaliman@unimap.edu.myen_US
dc.contributor.urlvc.sundress@gmail.comen_US
dc.contributor.urlfairul@unimap.edu.myen_US
dc.contributor.urlphaklen@unimap.edu.myen_US
dc.contributor.urlmuhamadhafiz@unimap.edu.myen_US


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