Browsing Ho Li Ngee, Dr. by Subject "Conductive fillers"
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Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives
(Springer Science+Business Media New York, 2013-06)Effects of post curing and silane coupling agents with different functional groups such as epoxy, isocyanate and ureide on the electrical and mechanical properties of copper (Cu) filled electrically conductive adhesives ...