Browsing Azmi Kamardin by Author "azmikamardin@unimap.edu.my"

Now showing items 1-6 of 6

    • Cu-SiCp composites as advanced electronic packaging materials 

      Azmi, Kamardin; Mohd Nazree, Derman, Dr.; Mohd Mustafa Al Bakri, Abdullah; Sandu, A.V. (Trans Tech Publications, 2014)
      The demand for advanced thermal management materials such as silicon carbide particles reinforced copper matrix (Cu-SiCp) composites is increasing due to the stringent design requirement in the electronic packaging industries. ...

    • The effects of autocatalyst copper coating of SiCp on the microstructure of CuSiCp composites 

      Azmi, Kamardin; Mohd Nazree, Derman; Shaiful Rizam Shamsudin; Mazlee, Mohd Noor; J.A.H., Iqwan (Universiti Malaysia Perlis, 2009-12-01)
      In this paper, the autocatalyst copper coating (ACC) of silicon carbide particle (SiCp) was performed after a sequence of surface treatment, sensitization and surface activation processes. The ACC process was operated ...

    • Metallurgical failure analysis of a closed recirculation system water cooling pipe 

      Mohd Arif Anuar, Mohd Salleh; Shaiful Rizam, Shamsudin; Azmi, Kamardin; Noor Hamidi, Mohd Noor; Hafizan, Hassan (Trans Tech Publications, 2013)
      Catastrophic failure is often associated with a large temperature rise. This situation may lead to a drastic deterioration in material strength where a cooling system is important for a smooth system plant operation to ...

    • Synthesis and characterization of electroless copper coated SiC particles 

      Azmi, Kamardin; Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman, Dr. (Trans Tech Publications, 2013)
      Silicon carbide reinforced copper matrix (Cu-SiCp) composites fabricated via the conventional powder metallurgy methods have inferior thermophysical properties due to the weak bonding between the copper matrix and the SiCp ...

    • Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique 

      Azmi, Kamardin; Mohd Nazree, Derman, Dr.; Mohd Mustafa Al-Bakri, Abdullah; Sandu, A.V. (Trans Tech Publications, 2014-01)
      The introduction of the metal matrix composites as the advanced electronic packaging materials is highly anticipated because their thermal properties can be engineered to match those of semiconductors, ceramics substrates ...

    • The thermal expansion behaviors of Cu-SiCp composites 

      Azmi, Kamardin; Mohd Nazree, Derman, Dr.; Mohd Mustafa Al-Bakri, Abdullah (Trans Tech Publications, 2013)
      The demand for advanced thermal management materials such as silicon carbide reinforced copper matrix (Cu-SiCp) composites is increasing due to their high thermal conductivity and low CTE properties. However, the weak ...