Browsing Azmi Kamardin by Title

Now showing items 1-10 of 10

    • Cu-SiCp composites as advanced electronic packaging materials 

      Azmi, Kamardin; Mohd Nazree, Derman, Dr.; Mohd Mustafa Al Bakri, Abdullah; Sandu, A.V. (Trans Tech Publications, 2014)
      The demand for advanced thermal management materials such as silicon carbide particles reinforced copper matrix (Cu-SiCp) composites is increasing due to the stringent design requirement in the electronic packaging industries. ...

    • Development of a Lid Sealed furnace for the production of Magnesium alloys 

      Shaiful Rizam, Shamsudin; Azmi, Kamardin; Mohd Nazree, Derman; Shamsul Baharin, Jamaludin; Azremi, Abdullah Al Hadi; A.M.H. Firdaus; Mazlee, Mohd Noor; C.I. Mahdi; Abdul Razak, Daud; Roslinda, Shamsudin (Universiti Kebangsaan Malaysia (UKM), 2008-12-03)
      An atmosphere-controlled furnace was designed for the casting process of highly reactive Mg metal and its alloys. Instead of open crucible furnace, the melting process was done under controlled atmosphere which contained ...

    • The effects of autocatalyst copper coating of SiCp on the microstructure of CuSiCp composites 

      Azmi, Kamardin; Mohd Nazree, Derman; Shaiful Rizam Shamsudin; Mazlee, Mohd Noor; J.A.H., Iqwan (Universiti Malaysia Perlis, 2009-12-01)
      In this paper, the autocatalyst copper coating (ACC) of silicon carbide particle (SiCp) was performed after a sequence of surface treatment, sensitization and surface activation processes. The ACC process was operated ...

    • Failure analysis on a ruptured petrochemical pipe 

      Mohd, Harun; Shaiful Rizam, Shamsudin; Azmi, Kamardin (Carl Hanser Verlag, 2010-03-16)
      The failure took place on a welded elbow pipe which exhibited a catastrophic transverse rupture. The failure was located on the welding HAZ region, parallel to the welding path. Branching cracks were detected at the ...

    • Long term overheating failure of a closed recirculation system water cooling pipe 

      Mohd Arif Anuar, Mohd Salleh; Shaiful Rizam, Shamsudin; Azmi, Kamardin; Hafizan, Hassan (SIRIM, 2010-11-22)
      Catastrophic failure is often associated with a large temperature rise. This situation may lead to a drastic deterioration in material strength where a cooling system is important for a smooth system plant operation to ...

    • Metallurgical failure analysis of a closed recirculation system water cooling pipe 

      Mohd Arif Anuar, Mohd Salleh; Shaiful Rizam, Shamsudin; Azmi, Kamardin; Noor Hamidi, Mohd Noor; Hafizan, Hassan (Trans Tech Publications, 2013)
      Catastrophic failure is often associated with a large temperature rise. This situation may lead to a drastic deterioration in material strength where a cooling system is important for a smooth system plant operation to ...

    • Potentiodynamic polarization of Mg-0.22ca alloys containing minor element of Aluminium 

      Shaiful Rizam, Shamsudin; Mohd Nazree, Derman; C.I., Mahdi; Azmi, Kamardin; Abd. Razak, Daud; Mazlee, Mohd Noor; A.M.H., Firdaus; G., Sasirehka (Universiti Malaysia Perlis, 2009-12-01)
      Mg alloys played a significant role in replacing the existing sacrificial anodes. To maintain the negative potential and its capability in preventing corrosion, Ca and Al was added as alloying elements. Polarization curves ...

    • Synthesis and characterization of electroless copper coated SiC particles 

      Azmi, Kamardin; Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman, Dr. (Trans Tech Publications, 2013)
      Silicon carbide reinforced copper matrix (Cu-SiCp) composites fabricated via the conventional powder metallurgy methods have inferior thermophysical properties due to the weak bonding between the copper matrix and the SiCp ...

    • Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique 

      Azmi, Kamardin; Mohd Nazree, Derman, Dr.; Mohd Mustafa Al-Bakri, Abdullah; Sandu, A.V. (Trans Tech Publications, 2014-01)
      The introduction of the metal matrix composites as the advanced electronic packaging materials is highly anticipated because their thermal properties can be engineered to match those of semiconductors, ceramics substrates ...

    • The thermal expansion behaviors of Cu-SiCp composites 

      Azmi, Kamardin; Mohd Nazree, Derman, Dr.; Mohd Mustafa Al-Bakri, Abdullah (Trans Tech Publications, 2013)
      The demand for advanced thermal management materials such as silicon carbide reinforced copper matrix (Cu-SiCp) composites is increasing due to their high thermal conductivity and low CTE properties. However, the weak ...