| dc.contributor.author | Norainiza, Saud | |
| dc.contributor.author | Rita, Mohd Said | |
| dc.contributor.author | Mohd Arif Anuar, Mohd Salleh | |
| dc.contributor.author | Mohd Nazree, Derman | |
| dc.contributor.author | Mohd Izrul Izwan, Ramli | |
| dc.contributor.author | Norhayanti, Mohd Nasir | |
| dc.date.accessioned | 2020-12-30T01:56:44Z | |
| dc.date.available | 2020-12-30T01:56:44Z | |
| dc.date.issued | 2016 | |
| dc.identifier.citation | MATEC Web Conferences, vol.78, 2016, 5 pages | en_US |
| dc.identifier.issn | 2261-236X (online) | |
| dc.identifier.uri | http://dspace.unimap.edu.my:80/xmlui/handle/123456789/69170 | |
| dc.description | Link to publisher's homepage at https://www.matec-conferences.org/ | en_US |
| dc.description.abstract | In this research, varying fraction of titanium oxide (TiO2) reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite. Sn-Cu-Ni solder paste composite was produced by mixing TiO2 particle with Sn-Cu-Ni solder paste. The microstructure analysis was carried out by Scanning Electron Microscopy-Energy dispersive X-ray (SEM-EDX). The addition TiO2 particle helps to refine the bulk solder microstructure and suppress the intermetallic compound (IMC) formation at the interface as will be discussed further | en_US |
| dc.language.iso | en | en_US |
| dc.publisher | EDP Sciences | en_US |
| dc.relation.ispartofseries | 2nd International Conference on Green Design and Manufacture 2016 (IConGDM 2016); | |
| dc.subject | Titanium oxide (TiO2) | en_US |
| dc.subject | Solder | en_US |
| dc.title | An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite | en_US |
| dc.type | Article | en_US |
| dc.identifier.doi | https://doi.org/10.1051/matecconf/20167801070 | |
| dc.contributor.url | norainiza@unimap.edu.my | en_US |
