PMMA characterization and optimization for Nano Structure formation
Date
2005-05-18Author
S Niza, Mohammad Bajuri
Nur Hamidah, Abdul Halim
Mohammad Nuzaihan, Md Nor
Uda, Hashim
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Show full item recordAbstract
The limitations imposed on optical lithography by the wavelength of light have been overcome using electron lithography. Electron lithography offers high resolution
because of the small wavelength of the 10-50 keV electrons and not sensitive in near UV. The resolution of electron lithography
systems is limited by electron scattering in the resist not by the diffraction. One of the limitations of the resolution is resist
thickness besides of beam energy and substrate compositions. Resist thickness is controlled by many factors such as velocity
of the spinner, solid content and the viscosity of the resist. The resist commonly used on electron lithography is PMMA or
Polymethyl-Methacrylate. In this paper, the effect of three parameters (as concerned above) on resist thickness is focused.