| dc.contributor.author | Nur Syahirah, Mohamad Zaim | |
| dc.contributor.author | Mohd Arif Anuar, Mohd Salleh | |
| dc.contributor.author | Mohd Mustafa Al Bakri, Abdullah | |
| dc.contributor.author | Marliza, Mostapha | |
| dc.contributor.author | Romisuhani, Ahmad | |
| dc.contributor | Center of Excellence Geopolymer and Green Technology (CEGeoGTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP) | en_US |
| dc.contributor | Faculty of Engineering Technology, Universiti Malaysia Perlis (UniMAP) | en_US |
| dc.creator | Mohd Arif Anuar, Mohd Salleh | |
| dc.date | 2022 | |
| dc.date.accessioned | 2022-03-16T00:56:03Z | |
| dc.date.available | 2022-03-16T00:56:03Z | |
| dc.date.issued | 2019-12 | |
| dc.identifier.citation | IOP Conference Services: Material Sciences Engineering, vol.701, 2019, 7 pages | en_US |
| dc.identifier.issn | 1757-899x (online) | |
| dc.identifier.uri | http://dspace.unimap.edu.my:80/xmlui/handle/123456789/74682 | |
| dc.description | Link to publisher's homepage at https://iopscience.iop.org/ | en_US |
| dc.description.abstract | The effect of kaolin geopolymer ceramic addition to the wettability and electrical resistivity of Sn-3.0Ag-0.5Cu (SAC305) lead free solder was successfully explored. Powder metallurgy with microwave sintering method was used to fabricate SAC305 composite solder. Five different weight percentage (wt.%) of kaolin geopolymer ceramic (0, 0.5, 1.0, 1.5 and 2.0 wt.%) were used in this study. The wettability of composite solder revealed the optimum contact angle was achieved at 1.0 wt.% with 20.8 °. Then, the electrical resistivity of composite solder showed significant change in the resistivity value. | en_US |
| dc.language.iso | en | en_US |
| dc.publisher | IOP Publishing Ltd | en_US |
| dc.subject.other | Kaolin geopolymer ceramic | en_US |
| dc.subject.other | Geopolymers | en_US |
| dc.subject.other | Solder | en_US |
| dc.title | Influence of kaolin geopolymer ceramic additions to the wettability and electrical properties of Sn-3.0Ag-0.5Cu (SAC305) lead free solder | en_US |
| dc.type | Article | en_US |
| dc.identifier.doi | https://doi.org/10.1088/1757-899x/701/1/012033 | |
| dc.contributor.url | arifanuar@unimap.edu.my | en_US |
