Statistics
Total Visits
| Views | |
|---|---|
| Technical barriers and development of Cu wirebonding in nanoelectronics device packaging | 178 |
Total Visits Per Month
| March 2025 | April 2025 | May 2025 | June 2025 | July 2025 | August 2025 | September 2025 | |
|---|---|---|---|---|---|---|---|
| Technical barriers and development of Cu wirebonding in nanoelectronics device packaging | 3 | 3 | 7 | 5 | 3 | 14 | 23 |
File Visits
| Views | |
|---|---|
| 173025.pdf | 53 |
Top country views
| Views | |
|---|---|
| United States | 82 |
| China | 14 |
| Sweden | 13 |
| Brazil | 8 |
| Ireland | 8 |
| Finland | 6 |
| Germany | 5 |
| India | 5 |
| Argentina | 4 |
| Australia | 4 |
Top cities views
| Views | |
|---|---|
| San Mateo | 12 |
| Boardman | 8 |
| Dublin | 8 |
| Ashburn | 3 |
| Des Moines | 3 |
| Hanoi | 3 |
| Melbourne | 3 |
| Andover | 2 |
| Balashikha | 2 |
| Kuala Lumpur | 2 |