Statistics
Total Visits
| Views | |
|---|---|
| Extended reliability of gold and copper ball bonds in microelectronic packaging | 190 |
Total Visits Per Month
| February 2025 | March 2025 | April 2025 | May 2025 | June 2025 | July 2025 | August 2025 | |
|---|---|---|---|---|---|---|---|
| Extended reliability of gold and copper ball bonds in microelectronic packaging | 4 | 3 | 2 | 3 | 6 | 3 | 2 |
File Visits
| Views | |
|---|---|
| Extended reliability of gold and copper ball bonds in microelectronic packaging.pdf | 5 |
Top country views
| Views | |
|---|---|
| United States | 93 |
| China | 13 |
| Finland | 12 |
| Russia | 12 |
| Germany | 10 |
| Ireland | 8 |
| Singapore | 6 |
| Malaysia | 5 |
| Sweden | 5 |
| Brazil | 4 |
Top cities views
| Views | |
|---|---|
| Mountain View | 19 |
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| Boardman | 6 |
| Ashburn | 3 |
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| Singapore | 3 |
| Chicago | 2 |
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