Statistics
Total Visits
| Views | |
|---|---|
| Extended reliability of gold and copper ball bonds in microelectronic packaging | 175 |
Total Visits Per Month
| October 2024 | November 2024 | December 2024 | January 2025 | February 2025 | March 2025 | April 2025 | |
|---|---|---|---|---|---|---|---|
| Extended reliability of gold and copper ball bonds in microelectronic packaging | 3 | 3 | 3 | 11 | 4 | 3 | 1 |
File Visits
| Views | |
|---|---|
| Extended reliability of gold and copper ball bonds in microelectronic packaging.pdf | 5 |
Top country views
| Views | |
|---|---|
| United States | 90 |
| Finland | 12 |
| Russia | 12 |
| Germany | 10 |
| China | 8 |
| Ireland | 8 |
| Sweden | 5 |
| Singapore | 5 |
| Malaysia | 4 |
| United Kingdom | 3 |
Top cities views
| Views | |
|---|---|
| Mountain View | 19 |
| San Mateo | 16 |
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| Boardman | 6 |
| Ashburn | 3 |
| Hanoi | 3 |
| Kuala Lumpur | 3 |
| Chicago | 2 |
| Mersin | 2 |
| Seattle | 2 |