Statistics
Total Visits
| Views | |
|---|---|
| Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate | 130 |
Total Visits Per Month
| January 2025 | February 2025 | March 2025 | April 2025 | May 2025 | June 2025 | July 2025 | |
|---|---|---|---|---|---|---|---|
| Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate | 8 | 2 | 0 | 5 | 3 | 1 | 3 |
File Visits
| Views | |
|---|---|
| Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-07Cu-Si3N4 composite solder on copper substrate.pdf | 34 |
Top country views
| Views | |
|---|---|
| United States | 67 |
| Ireland | 9 |
| China | 6 |
| Australia | 4 |
| Brazil | 4 |
| Singapore | 4 |
| Germany | 3 |
| Vietnam | 3 |
| Belgium | 2 |
| Japan | 2 |
Top cities views
| Views | |
|---|---|
| San Mateo | 17 |
| Dublin | 9 |
| Boardman | 5 |
| Ashburn | 4 |
| Andover | 3 |
| Hangzhou | 3 |
| Hanoi | 3 |
| Brisbane | 2 |
| Columbus | 2 |
| Mersin | 2 |