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dc.contributor.authorZaliman, Sauli, Dr.
dc.contributor.authorRetnasamy, Vithyacharan
dc.contributor.authorKamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.
dc.contributor.authorVairavan, Rajendaran
dc.date.accessioned2014-06-16T00:59:04Z
dc.date.available2014-06-16T00:59:04Z
dc.date.issued2013-10
dc.identifier.citationAdvances in Environmental Biology, vol. 7(SPEC. ISSUE 12), 2013, pages 3639-3643en_US
dc.identifier.issn1995-0756
dc.identifier.urihttp://www.aensiweb.com/old/aeb_October-special_2013.html
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/35525
dc.descriptionLink to publisher's homepage at http://www.aensiweb.com/en_US
dc.description.abstractHigh power light emitting diodes have the edge over the conventional lighting system in terms of efficiency, low energy consumption and long operational lifetime. Nevertheless, the heat dissipation issue of the high power LED bottlenecks the fulfilment of the potential possessed by the LED. The heat dissipation of LED is evaluated in terms of junction temperature. In this work, simulation was carried out to evaluate the heat dissipation of a single chip LED attached to a copper based cylindrical heat slug. The junction temperature and the stress of the LED chip were scrutinized under natural convection condition with applied input power of 0.1 W and 1 W. Ansys version 11 was utilized for the simulation. For input power of 1 W, the maximum junction temperature and Von Mises of 117.44°C and 229.21MPa was exhibited by the GaN based chip.en_US
dc.language.isoenen_US
dc.publisherAENSI Publicationsen_US
dc.subjectAnsysen_US
dc.subjectCylindrical copper diamond composite heat slugen_US
dc.subjectGaN LEDen_US
dc.subjectJunction temperatureen_US
dc.titleCylindrical shape slug heat conduction numerical analysis using copper materialen_US
dc.typeArticleen_US
dc.contributor.urlzaliman@unimap.edu.myen_US
dc.contributor.urlvc.sundress@gmail.comen_US
dc.contributor.urlvc@unimap.edu.myen_US


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