Vithyacharan Retnasamy
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This page provides access to research works by Vithyacharan Retnasamy, currently a Senior Lecturer of School of Microelectronic Engineering, Universiti Malaysia Perlis (UniMAP).
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Skills and Expertise:Thin Films and Nanotechnology,Stress Analysis,Nanoelectronics Electronic Engineering,Semiconductor,Microelectronics and Semiconductor Engineering Microelectronics,Industrial Engineering,Manufacturing Engineering,GaN,ANSYS Copper,Polymers & Microfluidics,LED,Grid,Light Emitting Diode,Soldering Microelectromechanical Systems (MEMS),Scopus,Machine Parameter Optimization Design of Experiments-Full facorial,Microfabrication Process Optimization and Semiconductor Packaging Process Optimization.
Recent Submissions
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LED heat dissipation analysis using composite based cylindrical slug
(Trans Tech Publications Inc., 2014-02)The optical efficacy and reliability of light emitting diode is extensively influenced by the operating junction temperature of the LED. Therefore, the evaluation of junction temperature is significant. This paper reports ... -
Effects of heat slug shapes on the heat dissipation of high power LED
(Trans Tech Publications Inc., 2014-02)High power light emitting diodes are currently challenged by thermal issue of high heat generation which limits the reliability and efficiency. Each component in the LED package has a significant role in heat dissipation. ... -
Wettability and surface roughness study on RIE treated aluminium deposited surface
(Trans Tech Publications, 2014-04)Design of Experiment (DOE) is a technique for optimizing process which has controllable inputs and measurable outputs. As a method of DOE, 24 Full Factorial design is used to study the effect of Reactive Ion Etch towards ... -
Heat dissipation analysis under natural convection condition on high power LED
(AENSI Publisher All rights reserved, 2013-10)As the technology downscales with superior power and increased package density, the thermal effects of the high power LED are significant. Thus, the operating junction temperature of the high power light emitting diodes ... -
High power LED heat dissipation analysis via copper diamond slug
(AENSI Publisher All rights reserved, 2013-10)The emergence of high power light emitting diode as a novel electronic based light source is due to its vast advantage in terms of optical efficacy, low power consumption and enhanced life time. However, the performances ... -
LED heat dissipation study using different Cu slug size
(AENSI Publisher All rights reserved, 2013-10)High power light emitting diodes (LEDs) have significant contribution in illumination industry due exceptional advantages in terms of low power consumption, superior reliability, prolonged life time and high efficiency. ... -
Numerical analysis of velocity profile in a FFS microchannel
(AENSI Publisher All rights reserved, 2013-10)Manipulation of the fluid flow behavior in microfluidic with precision technique is crucial to satisfy the needs of miniaturized systems. Velocity measurement is one of the physical phenomena plays significant role to ... -
FSS microchannel fluid flow profile investigation at high and low Re number
(AENSI Publisher All rights reserved, 2013-10)The fundamental understanding of dynamic fluid flow behavior in different geometry channel is crucial due to transport phenomena influence on the key design and process control of the microfluidic systems. Recently, the ... -
Low density fibrous material surface light reflectance analysis
(AENSI Publisher All rights reserved, 2013-10)The light based surface finishing of most product measurement is an important feature in the industries. In this paper, a lab fabricated tester for investigation on the quality of low density paper which was represent by ... -
Shear strain analysis in FSS microchannel
(AENSI Publications, 2013-10)Microfluidics has motivated the development of various fields in biological engineering due to its advantages. The favorable benefits of using microfluidicsare being easy to fabricate, requirement of minimal fluid volumes, ... -
Cylindrical shape slug heat conduction numerical analysis using copper material
(AENSI Publications, 2013-10)High power light emitting diodes have the edge over the conventional lighting system in terms of efficiency, low energy consumption and long operational lifetime. Nevertheless, the heat dissipation issue of the high power ... -
Bump height at low temperature analysis
(Trans Tech Publications (TTP), 2013)The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold ... -
Shear speed analysis on Sn-3.9Ag-0.6Cu Solder
(Trans Tech Publications (TTP), 2013)Ball Grid Array (BGA) is a type of semiconductor interconnection used in Integrated Circuit (IC) which is being scaled down to micro and nano size. The reliability of BGA in IC becomes a concern as the size of IC reduces. ... -
5mm × 5mm sized slug on high power LED stress and junction temperature analysis
(Trans Tech Publications (TTP), 2013)Conventional incandescent lamps are being replaced by high power light emitting diode as a lighting source due to it ascendancy in terms of physical size, performance, output and lifetime. Nevertheless, the reliability and ... -
Aluminium surface grain size analysis on RIE treatment
(Trans Tech Publications (TTP), 2013)Reactive Ion Etch (RIE) has been an important process in the world of microelectronic fabrication. Focus of this preliminary study is on how RIE affects the grain size of aluminum film which is fabricated on substrates. ... -
Relationship between controllable process parameters on bump height in ENIG
(Trans Tech Publications, 2013)This paper reports the factors that affect the bump height in electroless nickel immersion gold (ENIG) and their interrelation between each other. Bump height is a critical issue that needs to be investigated because a ... -
Wettability analysis on platinum deposited wafer after reactive ion ecthing using SF6+argon/CF4+argon gaseous
(AENSI Publisher All rights reserved, 2013-10)Wettability in microfluidic has direct influence to its fluid flow channels. This paper investigates the variable parameters that affect the wetability in terms of contact angle on a Platinum deposited wafer after reactive ... -
Investigation of dielectric characteristics and tunability of Ba0.8Sr0.2TiO3
(AENSI Publisher All rights reserved, 2013-10)It's been years ferroelectric materials has become a popular fields for research. Many methods were used for the barium strontium titanate (BST) preparation like sol-gel method, radio frequency (RF) magnetron sputtering, ... -
Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology
(Emerald Group Publishing Limited, 2013)Purpose - This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue, formed during the die attachment ... -
Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS
(Emerald Group Publishing Limited, 2013)Purpose - The increased use recently of area-array technology in electronic packaging has similarly increased the importance of predicting the thermal distribution of area-array solder interconnection. As the interconnection ...
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