High power LED heat dissipation analysis via copper diamond slug

Abstract

The emergence of high power light emitting diode as a novel electronic based light source is due to its vast advantage in terms of optical efficacy, low power consumption and enhanced life time. However, the performances of the LEDs are dependent on the junction temperature as it is inherited high heat production. Hence, proper evaluation of the junction temperature is very significant. In this paper, the heat dissipation of single chip high power LED attached to copper diamond based cylindrical heat slug was scrutinized through simulation. The heat dissipation was characterized in terms of junction temperature. In addition, the stress of the LED chip is evaluated with varied input power. Ansys version 11 was used for the simulation. The simulated results reveal that at input power of 1 W, the max junction temperature of the LED is 114.69°C.