Browsing School of Microelectronic Engineering (FYP) by Issue Date
Now showing items 1-20 of 153
-
Synthesis, layout design and simulation of 8-bit Serial Peripheral Interface (SPI) using Leonardo Spectrum and Mentor Graphics tools
(Universiti Malaysia PerlisSchool Of Microelectronic Engineering, 2007)In this project, Serial Peripheral Interface (SPI), was designed. This project will include design, synthesis and simulation of SPI. SPI is a synchronous serial data link that operates in full duplex mode and it will ... -
BST Sensor Application: Digital Thermometer
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)This thesis deals with the research of Barium Strontium Titanate (BST) sensor and its application as digital thermometer. In general BST sensor was still in research stage, because this sensor is the first BST sensors that ... -
BTST Thin Film Sensor Application: Heat Indicator
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)This report contains an account of my final year project, which was carried out in the forth year of the Electronic Engineering (B.Eng) degree at Universiti Malaysia Perlis. This paper is based on the design and analysis ... -
FPGA Implementation of One Lane Traffic Light Controller
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)Two-way automobile traffic must be supported by a single lane road, such as on narrow bridges in the country, roads under repair, and other narrow streets to prevent road jammed and car accident. To control the two-way ... -
Design and implementation of a Music Box using FPGA
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)A design and implementation of music box using FPGA is presented in this report. FPGA is a digital logic chip that can be programmed to do almost any digital function. An effort has been carried out to make the FPGA to ... -
Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)The characterization of electroless under bump metallurgy for AlSi bond pad composition in term of surface morphology and surface roughness was investigated. By using the sample given, the gold layer need to be deposited ... -
Characterization of Intermetallic Growth in Gold Ballbonds on Aluminum Metallization
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)The objective of this project is to study the capability of gold wire bonding process by investigating the intermetallic growth between gold ball bonds and aluminum bond pad. The study includes applying thermal storage ... -
Polysilicon Process Development – The Effect Of PECVD Process Parameters On The Film Characteristics
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)Thin polycrystalline silicon film has been used in the wide range of applications in the production of integrated circuits and other electronic products. Traditionally, polycrystalline silicon is deposited using Low ... -
Simulation on Effects of Different Types of Channel/Drain Engineering Structure on MOS Device Performance
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)This final year project is aimed to analyze the effects of three different types of channel/drain engineering structure on MOS transistor performance. As a project basis, a 0.35μm process recipe from UC Berkeley is used ... -
Designing, Fabricating And Characterizing A Microfluidic Capacitor
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)Today, being the dawn of a new technology wave, Micro electromechanical Systems or MEMS have promised a new beginning to a wide spectrum of fields. Microfluidics marked another milestone in this area as highly effective ... -
High speed six operands 16-bits carry save adder
(School of Microelectronic Engineering, 2007-03)Adders are commonly found in the critical path of many building blocks of microprocessors and digital signal processing chips. The most important for measuring the quality of adder designs in the past were propagation ... -
The Effect of Power Density on the Surface Layer of Amorphous Thin Film
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)The development of amorphous silicon (a-Si) device technology since the advent of the first solar cell in 1974 has been truly spectacular with commercial products such as photocopiers, laser printers, facsimile machines, ... -
BST Sensor Application: Programmable Night Lamp With Morning Alarm
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)A high potential BST Sensor fabricated at UniMAP’s Clean Room was left unused from any further development even though it has good characteristics. The main aim for this project is to develop an application system prototype ... -
Effect of Annealing Temperature and Dopant Concentration on the Surface Layer of Indium Doped Ba0.5Sr0.5TiO3 Thin Film
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)Barium strontium titanate (Ba0.5Sr0.5TiO3) is one of the most important sensing materials for multi-function sensors. Basically, the sensing properties can be controlled by minor modification of the dopants. The purpose ... -
Simulation on Parameter and Characteristics Extraction Between Two Simulation Packages (Synopsys and PSpice)
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)The progress of silicon technologies in the last twenty years has traced the path to the unprecedented revolution of information technologies, which has changed everybody’s lifestyles. Apparently, this has happened with ... -
Microfluidic Poly-Si Electrodes Capacitor ( Fabrication & Testing )
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)In this project, I have to design, fabricate and testing a Microfluidic capacitor. The dielectric insulator is replaced with a dielectric fluid (deionized water) instead of usual solid state materials. The conductive ... -
Study the effect of bird’s beak on Fully Recessed LOCOS and Poly Buffered LOCOS using 2 different pad Oxide
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)Device isolation is one of the most important technology features towards the realization of very large scale CMOS device integration. Since the early days of semiconductor industry, LOCOS isolation has been the major ... -
FPGA Implementation of Cash Money Register
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)Cash money register will record all the sales and help the traders to see with more clearly about their sale. Most sales that have been made will be finish by pressing key “enter” at the keyboard. At the same time, a ... -
Study of Semi-Recessed LOCOS for Quasi-nanoscale CMOS Device Isolation
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)This project is entitled as semi-recessed LOCOS for CMOS device isolation. Local oxidation (LOCOS) technique is a widely used method for device isolation in semiconductor process integration. It is a simple, cheap yet and ... -
16-Bits High Speed Carry Select Adder
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)This report presents the design, performance evaluation of two design of 16-bit carry select adder. The layout for the high speed 16-bits carry-select adder was present in this report. The comparison of both designs is to ...