Browsing School of Microelectronic Engineering (FYP) by Subject "Aluminum bond pad"
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Characterization of Intermetallic Growth in Gold Ballbonds on Aluminum Metallization
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)The objective of this project is to study the capability of gold wire bonding process by investigating the intermetallic growth between gold ball bonds and aluminum bond pad. The study includes applying thermal storage ...