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|---|---|
| Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life | 89 |
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| March 2024 | April 2024 | May 2024 | June 2024 | July 2024 | August 2024 | September 2024 | |
|---|---|---|---|---|---|---|---|
| Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life | 1 | 3 | 4 | 5 | 7 | 7 | 0 |
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| Views | |
|---|---|
| Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life.pdf | 33 |
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