dc.contributor.author | Hazimah, Rasid | |
dc.date.accessioned | 2017-05-16T04:45:06Z | |
dc.date.available | 2017-05-16T04:45:06Z | |
dc.date.issued | 2016-05 | |
dc.identifier.uri | http://dspace.unimap.edu.my:80/xmlui/handle/123456789/48096 | |
dc.description | Access is limited to UniMAP community. | en_US |
dc.description.abstract | The research in this study involves production and characterization of epoxy
syntactic foam with hollow spheres (EHoS) by using simple casting technique and
innovation process. The epoxy syntactic foam (ESF) comprises single coated and double
coated EHoS/ESF. Two different diameter of cell sizes EHoS also used which are small
size (1-3mm) and medium size (4-6mm). EHoS is produced by coating the EPS beads with
epoxy resin to save the cost whereas ESF is produced by embedding EHoS into mixture
epoxy – hardener with 3% KOH solution. It was observed that the density, compression
strength and modulus is higher for double coating (DC) of EHoS compared to single coated
(SC) because of thicker wall cell. However, for the mode of failure EHoS SC is crushing
and collapse completely and EHoS DC exhibits shear cracking matrix during compression
loading. However, for flatwise orientation demonstrates higher compression strength and
modulus than edgewise orientation due to the sample dimension has smaller aspect ratio so
lateral expansion is restricted. Lastly, ESF filled with small sizes of EHoS give higher
compression strength and modulus compared to ESF filled with medium size of EHoS. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Universiti Malaysia Perlis (UniMAP) | en_US |
dc.subject | Epoxy syntactic foam | en_US |
dc.subject | Epoxy syntactic foam with hollow spheres (EHoS) | en_US |
dc.subject | Hollow Spheres filler | en_US |
dc.subject | Hollow Spheres | en_US |
dc.subject | Filler | en_US |
dc.title | Production and charaterization of epoxy syntactic foam filled hollow spheres | en_US |
dc.type | Learning Object | en_US |
dc.contributor.advisor | Siti Salmi Samsudin | en_US |
dc.publisher.department | School of Microelectronic Engineering | en_US |