Browsing Vithyacharan Retnasamy by Title
Now showing items 1-20 of 54
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3D shape measurement and reconstruction using fringe projection
(Trans Tech Publications, 2014)Digital fringe projection technique using phase shifting method has been studied extensively for generatingthree dimensional (3D) surface information. The aim of this paper is to develop a simple automated optical inspection ... -
5mm × 5mm sized slug on high power LED stress and junction temperature analysis
(Trans Tech Publications (TTP), 2013)Conventional incandescent lamps are being replaced by high power light emitting diode as a lighting source due to it ascendancy in terms of physical size, performance, output and lifetime. Nevertheless, the reliability and ... -
Aluminium surface grain size analysis on RIE treatment
(Trans Tech Publications (TTP), 2013)Reactive Ion Etch (RIE) has been an important process in the world of microelectronic fabrication. Focus of this preliminary study is on how RIE affects the grain size of aluminum film which is fabricated on substrates. ... -
Analysis on surface roughness and surface reflectance through DOE
(Trans Tech Publications, 2014)The Lambda 950 spectrometers are designed to investigate and examine surface coating on test specimen by using the light source. The objective of this research is to investigate the factors that affect the surface roughness ... -
BaₓSr₁-ₓ TiO₃ different thickness analysis using sol gel approach
(Trans Tech Publications, 2014-01)Barium Strontium Titanate (BST) a common topic in the microelectronic field for many devices which is mainly on dynamic random access memories (DRAM). There are many methods of preparing BaₓSr₁-ₓTiO3; barium strontium ... -
Bump height at low temperature analysis
(Trans Tech Publications (TTP), 2013)The effects of chemical bath time in response to the bump height in electroless nickel immersion gold (ENIG) process was investigated. This paper presents the correlation between electroless process time, immersion gold ... -
Complex background subtraction for biometric identification
(IEEE Conference Publications, 2007)The background subtraction algorithm based on the YUV color space, image gradient and shape segmentation is used in this research to extract the region of interest from a real-time video surveillance camera. We choose to ... -
CuDia slug size variation analysis on heat dissipation of high power LED
(Trans Tech Publications, 2014-01)The current advancement of LED has prompt thermal challenges from the packaging point of view. The reliability of the LED is significantly influenced by each of its packaging component. This paper presents the investigation ... -
Cylindrical shape slug heat conduction numerical analysis using copper material
(AENSI Publications, 2013-10)High power light emitting diodes have the edge over the conventional lighting system in terms of efficiency, low energy consumption and long operational lifetime. Nevertheless, the heat dissipation issue of the high power ... -
Effects of heat slug shapes on the heat dissipation of high power LED
(Trans Tech Publications Inc., 2014-02)High power light emitting diodes are currently challenged by thermal issue of high heat generation which limits the reliability and efficiency. Each component in the LED package has a significant role in heat dissipation. ... -
Fibrous material density difference analysis using light reflectance
(Trans Tech Publications, 2014)The objective of this work is designed and fabricated a lab module tester to differentiate the different type of printing paper quality which available commercially was done. Laser light source was used to differentiate ... -
Fibrous material surface reflectance analysis
(Trans Tech Publications, 2014)The light inspection on surface finishing of most product measurement is an important feature in the industries. In this study, a lab module tester for examination on the different type quality of tissue paper quality was ... -
Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS
(Emerald Group Publishing Limited, 2013)Purpose - The increased use recently of area-array technology in electronic packaging has similarly increased the importance of predicting the thermal distribution of area-array solder interconnection. As the interconnection ... -
FSS microchannel fluid flow profile investigation at high and low Re number
(AENSI Publisher All rights reserved, 2013-10)The fundamental understanding of dynamic fluid flow behavior in different geometry channel is crucial due to transport phenomena influence on the key design and process control of the microfluidic systems. Recently, the ... -
Heart Caring "Handy" - Prototype
(Malaysian Invention and Design Society (MINDS), 2006-05-19)"Heart Carrying Handy" is designed to detect early abnormality in the heart pulse which will be deemed as a pre-heart attack sympton. -
Heat dissipation analysis under natural convection condition on high power LED
(AENSI Publisher All rights reserved, 2013-10)As the technology downscales with superior power and increased package density, the thermal effects of the high power LED are significant. Thus, the operating junction temperature of the high power light emitting diodes ... -
Heat sink fin number variation analysis on single chip high power LED
(Trans Tech Publications, 2014-01)Thermal management of high power LED is crucial the reliability and performance of the LED affected by the heat produced during photon emission. Heat sinks are utilized to dissipate the heat and to lower the operating ... -
Height measurement based on fringe projection
(Trans Tech Publications, 2014)A three-dimensional surface measurement using fringe projection technique has received attention among the researches for the last few decades.However choosing the best method is the challenge because one needs to consider ... -
High power LED heat dissipation analysis via copper diamond slug
(AENSI Publisher All rights reserved, 2013-10)The emergence of high power light emitting diode as a novel electronic based light source is due to its vast advantage in terms of optical efficacy, low power consumption and enhanced life time. However, the performances ... -
Interaction relationship analysis of surface roughness on aluminium etched wafer using RIE
(Trans Tech Publications, 2014)This paper presents the interaction relationships between Tetrafluoromethane (CF₄) gas, Oxygen (O₂) gas, and RF power in response to the surface roughness of an Aluminium deposited wafer after being etched using Reactive ...