dc.contributor.author | Nuramira Shahira, Asmuni | |
dc.contributor | School of Materials Engineering | en_US |
dc.date | 2023-12 | |
dc.date.accessioned | 2025-06-05T01:20:42Z | |
dc.date.available | 2025-06-05T01:20:42Z | |
dc.date.issued | 2017-06 | |
dc.identifier.uri | http://dspace.unimap.edu.my:80/xmlui/handle/123456789/84136 | |
dc.description | Access is limited to UniMAP community. | en_US |
dc.description.abstract | To investigate corrosion properties of Sn-0.7Cu solders at different scan rate in 3.5 wt% NaCl. To evaluate microstructure, elemental and phase evolution of Sn-0.7Cu solder after NaCl exposure. To study the corrosion mechanism of Sn-0.7Cu solder in 3.5 wt% NaCl. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Universiti Malaysia Perlis (UniMAP) | en_US |
dc.subject.other | Material engineering | en_US |
dc.subject.other | Solder | en_US |
dc.subject.other | Corrosion | en_US |
dc.subject.other | Salt solution | en_US |
dc.title | Effect of Potentiodynamic polerization scan rate on the corrosion performance of SN-0.7CU solder in salt solution | en_US |
dc.type | Learning Object | en_US |