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| Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application | 122 |
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| March 2024 | April 2024 | May 2024 | June 2024 | July 2024 | August 2024 | September 2024 | |
|---|---|---|---|---|---|---|---|
| Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application | 0 | 0 | 7 | 22 | 13 | 8 | 1 |
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| Results and discussion.pdf | 3 |
| Introduction.pdf | 3 |
| Referrences and Appendix.pdf | 1 |
| Conclusion.pdf | 1 |
| Methodology.pdf | 1 |
| Literature review.pdf | 1 |
| Abstract, Acknowledgement.pdf | 1 |
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