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| Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application | 171 |
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| February 2025 | March 2025 | April 2025 | May 2025 | June 2025 | July 2025 | August 2025 | |
|---|---|---|---|---|---|---|---|
| Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application | 6 | 9 | 2 | 4 | 7 | 0 | 4 |
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|---|---|
| Literature review.pdf | 5 |
| Referrences and Appendix.pdf | 4 |
| Results and discussion.pdf | 4 |
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| Abstract, Acknowledgement.pdf | 3 |
| Conclusion.pdf | 2 |
| Methodology.pdf | 2 |
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